November 2013
FD B 2710
N-Channel PowerTrench ? MOSFET
250 V, 5 0 A, 42.5 m ?
Features
? R DS(on) = 36.3 m Ω ( Typ.)@ V GS = 10 V, I D = 25 A
? High Performance Trench T echnology for Extremely Low
R DS(on)
? Low Gate Charge
? High Power and Current Handing Capability
General Description
This N-Channel MOSFET is produced using Fairchild
Semiconductor’s PowerTrench ? process that has been tailored
to minimize the on-state resistance while maintaining superior
switching performance.
Applications
? Synchronous Rectification
? Battery Protection Circuit
? Motor D rives and Uninterruptible Power Supplies
D
D
G
S
D 2 -PAK
G
S
Absolute Maximum Ratings
T C = 25°C unless otherwise noted
Symbol
V DS
V GS
Drain-Source Voltage
Gate-Source voltage
Parameter
FDB2710
250
± 30
Unit
V
V
I D
Drain Current
- Continuous (T C = 25 ° C)
- Continuous (T C = 100 ° C)
50
31.3
A
A
I DM
Drain Current
- Pulsed
(Note 1)
See Figure 9
A
E AS
dv/dt
Single Pulsed Avalanche Energy
Peak Diode Recovery dv/dt
(Note 2)
(Note 3)
145
4.5
mJ
V/ns
P D
Power Dissipation
(T C = 25 ° C)
- Derate above 25 ° C
260
2.1
W
W/ ° C
T J, T STG
T L
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
-55 to +150
300
° C
° C
Thermal Characteristics
Thermal Resistance, Junction to Ambient (1 in pad of 2 oz copper), Max.
Symbol
R θ JC
R θ JA
R θ JA
Parameter
Thermal Resistance, Junction-to-Case, Max.
Thermal Resistance, Junction to Ambient (minimum pad of 2 oz copper), Max.
2
FDB2 710
0.48
62.5
40
Unit
° C/W
° C/W
° C/W
?200 6 Fairchild Semiconductor Corporation
FDB2710 Rev. C1
1
www.fairchildsemi.com
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